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Indium Corporation's Heat-Spring thermal interface material enhances device performance-The 17th China(Guangzhou)Int’l Spring Industry Exhibition
10/27/2015  Spring Industry expo
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Indium Corporation announces a soft metal alloy thermal interface material (SMA TIM) that offers high and uniform thermal resistance at lower applied stresses in compressed interfaces.


The company''s patented Heat-Spring SMA TIM reduces thermal resistance and enhances cooling by utilizing two key properties of indium metal: superior thermal conductivity and malleability. Unlike standard thermal interface materials, Heat-Spring offers an extremely long service life as it does not pump out under power cycling, nor does it bake out over time. This combination of high conductance, high surface contact area (due to superior conformance), and low degradation over time produces a superior thermal interface and assures optimized long-term device performances in compressed interfaces.



弹簧展-2016第十七届广州国际弹簧工业展览会-全球最大弹簧展会-巨浪展览 -spring - spring industry - spring industry expo-The 17th China(Guangzhou)Int’l Spring Industry Exhibition

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